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The present invention relates to a method and apparatus for positioning a substrate within a reaction chamber, and more particularly to an improved method and apparatus which substantially reduces inaccuracies in substrate positioning.
Semiconductor substrate processing is typically performed within a process chamber configured to perform a single step of the overall process. After completing the single step, the substrate must be removed from the process chamber for further processing. The substrate must be positioned in the process chamber for performing the single step of the overall process. The substrate positioning must be accurate enough to minimize process and repeatability errors. After positioning the substrate in the process chamber, the substrate may be chemically or physically processed within the process chamber.
In an epitaxial deposition process, for example, an epitaxial deposition ring is rotated about a longitudinal axis to rotate a substrate for substrate positioning within the epitaxial deposition ring. However, known deposition rings are not as accurately positioned as may be desired. In particular, there are some gaps between parts of the deposition ring, which allows the substrate to shift and cause undesired substrate positioning in the process chamber.
Semiconductor substrate processing is typically performed within a process chamber configured to perform a single step of the overall process. After completing the single step, the substrate must be removed from the process chamber for further processing. The substrate must be positioned in the process chamber for performing the single step of the overall process. The substrate positioning must be accurate enough to minimize process and repeatability errors. After positioning the substrate in the process chamber, the substrate may be chemically or physically processed within the process chamber.
For the reasons stated above, and for other reasons stated below which will become apparent to those skilled in the art upon reading and understanding ac619d1d87
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